Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)

EU — Italia · scadenza 18/03/2027

Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)

Scadenza: 18/03/2027

Fonte: eu_funding_tenders

Tipo: EU

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Scheda (fonte ufficiale)

Topic metadata

  • EU Programme: Horizon Europe (ID 43108390)
  • Call identifier: HORIZON-CL4-2027-05
  • Call name: DIGITAL
  • Type: Topic
  • Opening date: 17/11/2026
  • Next deadline: 18/03/2027
  • Keywords: HORIZON-CL4-2027-05-DIGITAL-EMERGING-03, HORIZON-CL4-2027-05, Nanophysics: nanoelectronics, nanophotonics, nanomagnetism, nanoelectromechanics, etc., Optical engineering, photonics, lasers

Topic description

Expected Outcome:

  • Advanced integrated photonic devices and circuits with enhanced functionality and performance enabling wider application across multiple sectors including digital, automotive, industrial, health and security
  • Reinforced competitiveness of EU photonics actors by demonstrating advancements in representative system configurations and validating real-world applicability
  • Significantly improved performance of electro-optic systems in applications such as communication, computing, sensing, medical diagnostics, data processing, AI supporting the introduction of photonic elements into such systems
  • Low power consumption sensors with increased performance in application domains

Scope:

R&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects.

  • Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics.
  • Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs.
  • Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost-efficiency.
  • Reduction of power consumption for example through improved electrical-to-optical conversion, lower optical losses, devices operable at higher temperatures to reduce cooling needs, and low-power circuit actuation and control.

Proposals should consider system-level impact and demonstrate advancements in representative configurations relevant to one or more application domains.

This topic implements the co-programmed European Partnership on photonics.

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Activities are expected to start at TRL 3 and achieve TRL 6 by the end of the project – see General Annex B.